| contributor author | Z. Guo | |
| contributor author | A. F. Sprecher | |
| contributor author | H. Conrad | |
| date accessioned | 2017-05-08T23:38:07Z | |
| date available | 2017-05-08T23:38:07Z | |
| date copyright | June, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26129#112_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110063 | |
| description abstract | The deformation kinetics of near-eutectic Pb-Sn alloys in monotonic and cyclic loading in shear at 300K were investigated by determining the stress exponent n in the Dorn equation using several techniques including strain rate cycling. n was found to be a single-value function of the true stress for the present range of test conditions for both the monotonic and cyclic loading. It ranged from ~4 at the lowest stresses to ~30 at the highest stresses. The n-value of ~4 is concluded to represent dislocation glide and climb as the controlling mechanism, while values of n > 10 reflect power low breakdown. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2906406 | |
| journal fristpage | 112 | |
| journal lastpage | 117 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Low cycle fatigue | |
| keywords | Solder joints | |
| keywords | Stress | |
| keywords | Shear (Mechanics) | |
| keywords | Dislocations | |
| keywords | Equations | |
| keywords | Mechanisms AND Alloys | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002 | |
| contenttype | Fulltext | |