| contributor author | Z. Mei | |
| contributor author | J. W. Morris | |
| date accessioned | 2017-05-08T23:38:07Z | |
| date available | 2017-05-08T23:38:07Z | |
| date copyright | June, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26129#104_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110061 | |
| description abstract | This paper reports the results of a study on the effect of the cooling rate during solidification on the isothermal shear-fatigue life of 60Sn/40Pb solder joints. Solder joints are made with three different initial microstructures by quenching, air-cooling, and furnace-cooling. The test results show that the quench-solidified solder joints have isothermal fatigue lives of about twice long as those of the furnace cooled solder joints tested at 20°C and 65°C with the straining rates of about 10−4 per s. These results are ascribed to the refined grain size and less lamellar phase morphology that results on increasing the cooling rate. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Fatigue Lives on 60Sn/40Pb Solder Joints Made With Different Cooling Rates | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2906404 | |
| journal fristpage | 104 | |
| journal lastpage | 108 | |
| identifier eissn | 1043-7398 | |
| keywords | Fatigue | |
| keywords | Cooling | |
| keywords | Solder joints | |
| keywords | Furnaces | |
| keywords | Grain size | |
| keywords | Shear (Mechanics) | |
| keywords | Quenching (Metalworking) AND Solidification | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002 | |
| contenttype | Fulltext | |