contributor author | A. Hadim | |
contributor author | N. J. Nagurny | |
date accessioned | 2017-05-08T23:38:06Z | |
date available | 2017-05-08T23:38:06Z | |
date copyright | September, 1992 | |
date issued | 1992 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26132#300_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110046 | |
description abstract | Parametric studies are performed on heat transfer in surface-mounted components of conduction cooled Standard Electronic Modules (SEMs). Thermal network models are developed for the various components that are used in the SEMs. The models are validated by comparing the results with available experimental results from various test modules. An interfacing software package for thermal analysis (IN-STAN) is used to generate the thermal network representations of the models and a thermal network analyzer is used to perform the analysis. Several studies are performed to analyze the effects of important thermal design parameters including: chip and carrier size, cavity floor thickness, air gap thickness, die and carrier materials, and solder material. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Parametric Studies for Thermal Design of Surface Mounted Components of Standard Electronic Modules | |
type | Journal Paper | |
journal volume | 114 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905454 | |
journal fristpage | 300 | |
journal lastpage | 304 | |
identifier eissn | 1043-7398 | |
keywords | Design | |
keywords | Networks | |
keywords | Thickness | |
keywords | Thermal analysis | |
keywords | Heat transfer | |
keywords | Solders | |
keywords | Heat conduction | |
keywords | Cavities | |
keywords | Computer software AND Network models | |
tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003 | |
contenttype | Fulltext | |