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    PCB Trace Thermal Analysis and Effective Conductivity

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004::page 413
    Author:
    T. F. Lemczyk
    ,
    B. L. Mack
    ,
    J. R. Culham
    ,
    M. M. Yovanovich
    DOI: 10.1115/1.2905474
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The electrical current carrying capability of a surface or buried trace located within a fiberglass printed circuit board (PCB), is of important interest in the microelectronics industry. The maximum allowable trace power, hence local integrity and maximum allowable operating temperature, will depend on several parameters including the circuit board thermal conductivity, thickness, trace size and location. A two-dimensional, steady-state thermal conduction analysis is made on a finite, plane homogeneous medium (PCB), to examine the trace behavior. The trace is modeled as a zero-thickness, strip heat source with specified uniform temperature, and it’s position in the medium is varied. A two-dimensional thermal analysis is also performed on a multilayered cell model with finite heat source, to establish an accurate, effective thermal conductivity for a typical PCB. Results are tabulated and presented graphically for both the two-dimensional trace and effective conductivity models.
    keyword(s): Conductivity , Thermal analysis , Thickness , Thermal conductivity , Heat , Temperature , Electric current , Heat conduction , Glass reinforced plastics , Circuits , Steady state , Strips , Microelectronic devices , Operating temperature AND Printed circuit boards ,
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      PCB Trace Thermal Analysis and Effective Conductivity

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110027
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    • Journal of Electronic Packaging

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    contributor authorT. F. Lemczyk
    contributor authorB. L. Mack
    contributor authorJ. R. Culham
    contributor authorM. M. Yovanovich
    date accessioned2017-05-08T23:38:04Z
    date available2017-05-08T23:38:04Z
    date copyrightDecember, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26133#413_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110027
    description abstractThe electrical current carrying capability of a surface or buried trace located within a fiberglass printed circuit board (PCB), is of important interest in the microelectronics industry. The maximum allowable trace power, hence local integrity and maximum allowable operating temperature, will depend on several parameters including the circuit board thermal conductivity, thickness, trace size and location. A two-dimensional, steady-state thermal conduction analysis is made on a finite, plane homogeneous medium (PCB), to examine the trace behavior. The trace is modeled as a zero-thickness, strip heat source with specified uniform temperature, and it’s position in the medium is varied. A two-dimensional thermal analysis is also performed on a multilayered cell model with finite heat source, to establish an accurate, effective thermal conductivity for a typical PCB. Results are tabulated and presented graphically for both the two-dimensional trace and effective conductivity models.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePCB Trace Thermal Analysis and Effective Conductivity
    typeJournal Paper
    journal volume114
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905474
    journal fristpage413
    journal lastpage419
    identifier eissn1043-7398
    keywordsConductivity
    keywordsThermal analysis
    keywordsThickness
    keywordsThermal conductivity
    keywordsHeat
    keywordsTemperature
    keywordsElectric current
    keywordsHeat conduction
    keywordsGlass reinforced plastics
    keywordsCircuits
    keywordsSteady state
    keywordsStrips
    keywordsMicroelectronic devices
    keywordsOperating temperature AND Printed circuit boards
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian