| contributor author | A. O. Cifuentes | |
| contributor author | S. R. Stiffler | |
| date accessioned | 2017-05-08T23:38:04Z | |
| date available | 2017-05-08T23:38:04Z | |
| date copyright | December, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26133#397_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110024 | |
| description abstract | Periodic structures, that is, structures that consist of a basic pattern which is repeated multiple times, are commonplace in the electronics industry. This paper is concerned with the determination of thermal stresses in such structures. Specifically, it is demonstrated that thermal stresses can be computed using a reduced model, if one uses the correct boundary conditions. It is also shown that a reduced model can give very misleading results if incorrect boundary conditions are employed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Modeling Thermal Stresses in Periodic Structures: Some Observations Regarding the Boundary Conditions | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905471 | |
| journal fristpage | 397 | |
| journal lastpage | 402 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal stresses | |
| keywords | Modeling | |
| keywords | Boundary-value problems | |
| keywords | Periodic structures AND Electronics | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004 | |
| contenttype | Fulltext | |