Microelectronics and the Built-Up-Bar TheorySource: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004::page 384Author:B. Mirman
DOI: 10.1115/1.2905469Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The Built-up-Bar (BUB) theory is presently gaining recognition in microelectronics. This theory offers a useful method for computing stresses and strains in multilayered structures. However, it cannot be safely applied outside of the inherent assumptions that facilitated the convenient simplification of the general equations. This paper discusses methods for solution of basic equations of the BUB theory and cautions analysts about certain pitfalls.
keyword(s): Microelectronic devices , Equations AND Stress ,
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contributor author | B. Mirman | |
date accessioned | 2017-05-08T23:38:04Z | |
date available | 2017-05-08T23:38:04Z | |
date copyright | December, 1992 | |
date issued | 1992 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26133#384_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110021 | |
description abstract | The Built-up-Bar (BUB) theory is presently gaining recognition in microelectronics. This theory offers a useful method for computing stresses and strains in multilayered structures. However, it cannot be safely applied outside of the inherent assumptions that facilitated the convenient simplification of the general equations. This paper discusses methods for solution of basic equations of the BUB theory and cautions analysts about certain pitfalls. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Microelectronics and the Built-Up-Bar Theory | |
type | Journal Paper | |
journal volume | 114 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905469 | |
journal fristpage | 384 | |
journal lastpage | 388 | |
identifier eissn | 1043-7398 | |
keywords | Microelectronic devices | |
keywords | Equations AND Stress | |
tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 004 | |
contenttype | Fulltext |