YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001::page 40
    Author:
    Heiu-Jou Shaw
    ,
    Wen-Lih Chen
    ,
    Cha’o-Kuang Chen
    DOI: 10.1115/1.2905365
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, the mixed convective heat transfer phenomena in a three-dimensional channel with one heating-element is studied. A general-purpose computer program is developed to analyze the flow field and temperature distribution in the channel. In order to ensure the accuracy of result, numerical computation is performed by using the alternating direction implicit (A.D.I.) method based on the SIMPLER algorithm. This paper deals with fundamental heat transfer phenomena in “L.S.I.” package, which is used extensively in microelectronic equipment. The influences of Reynolds number and Grashof number on the Nusselt number of the heating-element are discussed. In order to make it easier for readers to understand the phenomena studied in this paper, three-dimensional streaklines and three-dimensional isothermal surfaces are presented.
    keyword(s): Channels (Hydraulic engineering) , Convection , Heating , Computation , Computer software , Temperature distribution , Reynolds number , Algorithms , Flow (Dynamics) AND Heat transfer ,
    • Download: (762.3Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Study on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/108415
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorHeiu-Jou Shaw
    contributor authorWen-Lih Chen
    contributor authorCha’o-Kuang Chen
    date accessioned2017-05-08T23:35:19Z
    date available2017-05-08T23:35:19Z
    date copyrightMarch, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26121#40_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108415
    description abstractIn this paper, the mixed convective heat transfer phenomena in a three-dimensional channel with one heating-element is studied. A general-purpose computer program is developed to analyze the flow field and temperature distribution in the channel. In order to ensure the accuracy of result, numerical computation is performed by using the alternating direction implicit (A.D.I.) method based on the SIMPLER algorithm. This paper deals with fundamental heat transfer phenomena in “L.S.I.” package, which is used extensively in microelectronic equipment. The influences of Reynolds number and Grashof number on the Nusselt number of the heating-element are discussed. In order to make it easier for readers to understand the phenomena studied in this paper, three-dimensional streaklines and three-dimensional isothermal surfaces are presented.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleStudy on the Laminar Mixed Convective Heat Transfer in Three-Dimensional Channel With a Thermal Source
    typeJournal Paper
    journal volume113
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905365
    journal fristpage40
    journal lastpage49
    identifier eissn1043-7398
    keywordsChannels (Hydraulic engineering)
    keywordsConvection
    keywordsHeating
    keywordsComputation
    keywordsComputer software
    keywordsTemperature distribution
    keywordsReynolds number
    keywordsAlgorithms
    keywordsFlow (Dynamics) AND Heat transfer
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 001
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian