| contributor author | Mikyoung Lee | |
| contributor author | I. Jasiuk | |
| date accessioned | 2017-05-08T23:35:18Z | |
| date available | 2017-05-08T23:35:18Z | |
| date copyright | June, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26122#173_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108402 | |
| description abstract | The plane elasticity problem of two semi-infinite bimaterial strips, that undergo constant temperature change, is considered. Following Bogy (1968), we use Airy stress function method, Mellin transform, and conformal mapping to investigate the asymptotic behavior of stresses at the interface near the edge of two strips. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905383 | |
| journal fristpage | 173 | |
| journal lastpage | 177 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal stresses | |
| keywords | Strips | |
| keywords | Stress | |
| keywords | Elasticity AND Temperature | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002 | |
| contenttype | Fulltext | |