A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic PackagingSource: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002::page 121Author:R. G. Ross
DOI: 10.1115/1.2905377Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.
keyword(s): Fatigue , Electronic packaging , Solder joints , Space vehicles , Cycles , Hardware , Failure , Solders , Flight , Electronics , Mechanisms , Physics , Reliability , Temperature AND Design ,
|
Collections
Show full item record
contributor author | R. G. Ross | |
date accessioned | 2017-05-08T23:35:18Z | |
date available | 2017-05-08T23:35:18Z | |
date copyright | June, 1991 | |
date issued | 1991 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26122#121_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108395 | |
description abstract | Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging | |
type | Journal Paper | |
journal volume | 113 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905377 | |
journal fristpage | 121 | |
journal lastpage | 128 | |
identifier eissn | 1043-7398 | |
keywords | Fatigue | |
keywords | Electronic packaging | |
keywords | Solder joints | |
keywords | Space vehicles | |
keywords | Cycles | |
keywords | Hardware | |
keywords | Failure | |
keywords | Solders | |
keywords | Flight | |
keywords | Electronics | |
keywords | Mechanisms | |
keywords | Physics | |
keywords | Reliability | |
keywords | Temperature AND Design | |
tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 002 | |
contenttype | Fulltext |