The Finite Element in ThermomechanicsSource: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 003::page 329DOI: 10.1115/1.2905415Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Finite element analysis AND Thermomechanics ,
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| contributor author | Tai-Ran Hsu | |
| contributor author | J. H. Lau | |
| date accessioned | 2017-05-08T23:35:13Z | |
| date available | 2017-05-08T23:35:13Z | |
| date copyright | September, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26123#329_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108368 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | The Finite Element in Thermomechanics | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905415 | |
| journal fristpage | 329 | |
| identifier eissn | 1043-7398 | |
| keywords | Finite element analysis AND Thermomechanics | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 003 | |
| contenttype | Fulltext |