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    A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations

    Source: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004::page 425
    Author:
    A. O. Cifuentes
    DOI: 10.1115/1.2905431
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This technical note shows that the determination of the stresses induced in multi-metal beams by temperature changes reduces to solving a linear system of equations. This system of equations has a very particular structure that allows one to obtain a closed form solution easily.
    keyword(s): Temperature , Metals , Thermal stresses , Equations , Linear systems AND Stress ,
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      A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations

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    http://yetl.yabesh.ir/yetl1/handle/yetl/108364
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    contributor authorA. O. Cifuentes
    date accessioned2017-05-08T23:35:12Z
    date available2017-05-08T23:35:12Z
    date copyrightDecember, 1991
    date issued1991
    identifier issn1528-9044
    identifier otherJEPAE4-26124#425_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/108364
    description abstractThis technical note shows that the determination of the stresses induced in multi-metal beams by temperature changes reduces to solving a linear system of equations. This system of equations has a very particular structure that allows one to obtain a closed form solution easily.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations
    typeJournal Paper
    journal volume113
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905431
    journal fristpage425
    journal lastpage427
    identifier eissn1043-7398
    keywordsTemperature
    keywordsMetals
    keywordsThermal stresses
    keywordsEquations
    keywordsLinear systems AND Stress
    treeJournal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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