Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal LoadsSource: Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004::page 355Author:A. O. Cifuentes
DOI: 10.1115/1.2905420Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The problem of determining the stresses in a bimaterial beam subjected to a thermal load is considered. One beam layer is assumed to be linear while the second layer is assumed to be elastoplastic. A simple analytical solution is derived and compared against results obtained with finite elements.
keyword(s): Stress AND Finite element analysis ,
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| contributor author | A. O. Cifuentes | |
| date accessioned | 2017-05-08T23:35:11Z | |
| date available | 2017-05-08T23:35:11Z | |
| date copyright | December, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26124#355_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108352 | |
| description abstract | The problem of determining the stresses in a bimaterial beam subjected to a thermal load is considered. One beam layer is assumed to be linear while the second layer is assumed to be elastoplastic. A simple analytical solution is derived and compared against results obtained with finite elements. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905420 | |
| journal fristpage | 355 | |
| journal lastpage | 358 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress AND Finite element analysis | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004 | |
| contenttype | Fulltext |