| contributor author | S. K. Patra | |
| contributor author | Y. C. Lee | |
| date accessioned | 2017-05-08T23:35:11Z | |
| date available | 2017-05-08T23:35:11Z | |
| date copyright | December, 1991 | |
| date issued | 1991 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26124#337_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108349 | |
| description abstract | A three-dimensional mathematical model simulating the self-alignment mechanism in the flip-chip soldering of a single joint has been developed. Based on the principle of energy minimization, it calculates the quasi-static surface profiles defined by the size of the solder pads, the solder volume, the surface tension coefficient, the vertical loading and the misalignment. The model is capable of calculating initial, intermediate and final profiles and their associated restoring forces during the solder reflow. It can provide the guidelines to improve the assembly yield and the stress-related reliability of the flip-chip soldering technology. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905417 | |
| journal fristpage | 337 | |
| journal lastpage | 342 | |
| identifier eissn | 1043-7398 | |
| keywords | Soldering | |
| keywords | Modeling | |
| keywords | Solder joints | |
| keywords | Flip-chip | |
| keywords | Mechanisms | |
| keywords | Solders | |
| keywords | Reflow soldering | |
| keywords | Force | |
| keywords | Surface tension | |
| keywords | Manufacturing | |
| keywords | Reliability | |
| keywords | Stress AND Energy conservation | |
| tree | Journal of Electronic Packaging:;1991:;volume( 113 ):;issue: 004 | |
| contenttype | Fulltext | |