| contributor author | Tae-Ho Song | |
| contributor author | Se Yoon Bang | |
| date accessioned | 2017-05-08T23:32:26Z | |
| date available | 2017-05-08T23:32:26Z | |
| date copyright | March, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26114#52_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106799 | |
| description abstract | A piston-type conduction cooling module for PCB-mounted IC’s has been developed and tested. Analysis of performance has been made using a finite difference scheme for the conduction piston. The effect of direct contact area between the piston and the IC as well as the effect of thermal conduction grease between them have been investigated. An analytical solution for the heat transfer coefficient of coolant flowing along the side of piston has been obtained. Excellent agreement between experimental and analytical results has been found. The overall thermal resistance from the IC to the coolant can be lowered to 3° C/W or less with negligible coolant-side pressure drop for practical applications. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Performance of a Conduction Cooling Module | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904341 | |
| journal fristpage | 52 | |
| journal lastpage | 56 | |
| identifier eissn | 1043-7398 | |
| keywords | Cooling | |
| keywords | Heat conduction | |
| keywords | Pistons | |
| keywords | Coolants | |
| keywords | Pressure drop | |
| keywords | Thermal resistance AND Heat transfer coefficients | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 001 | |
| contenttype | Fulltext | |