| contributor author | Z.-G. Du | |
| contributor author | E. Bilgen | |
| date accessioned | 2017-05-08T23:32:22Z | |
| date available | 2017-05-08T23:32:22Z | |
| date copyright | September, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26117#249_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106766 | |
| description abstract | Natural convection heat transfer has been studied in a sealed small PCB enclosure of three heated components which are mounted on a PCB plate within a large console cooled by vented airflow. A two-dimensional laminar flow model is used with appropriate boundary conditions. Detailed influences of each parameter, such as intensity, size, and position of the heaters on temperature and flow distributions within the enclosure have been studied. The favorable component arrangements for various cases have been determined. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904374 | |
| journal fristpage | 249 | |
| journal lastpage | 254 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Heat | |
| keywords | Temperature | |
| keywords | Heat transfer | |
| keywords | Air flow | |
| keywords | Laminar flow | |
| keywords | Natural convection | |
| keywords | Boundary-value problems AND Temperature distribution | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003 | |
| contenttype | Fulltext | |