| contributor author | S. M. Heinrich | |
| contributor author | A. F. Elkouh | |
| contributor author | Ping S. Lee | |
| contributor author | N. J. Nigro | |
| date accessioned | 2017-05-08T23:32:22Z | |
| date available | 2017-05-08T23:32:22Z | |
| date copyright | September, 1990 | |
| date issued | 1990 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26117#210_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106761 | |
| description abstract | An analytical model of solder joint formation during a surface mount reflow process is developed in the present paper, and the solution is obtained in an explicit integral form. For two limiting cases—infinitesimal and infinite solder areas—the solution is expressed in closed form. Numerical results illustrate the influence of the process parameters (surface tension, density, and cross-sectional area of the molten solder, and the contact angles between the solder andpretinning) on joint shape and overall fillet dimensions. Comparisons between theoretical predictions and laboratory data show excellent agreement. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Solder Joint Formation in Surface Mount Technology—Part I: Analysis | |
| type | Journal Paper | |
| journal volume | 112 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2904369 | |
| journal fristpage | 210 | |
| journal lastpage | 218 | |
| identifier eissn | 1043-7398 | |
| keywords | Solder joints | |
| keywords | Surface mount technology | |
| keywords | Solders | |
| keywords | Dimensions | |
| keywords | Shapes | |
| keywords | Density | |
| keywords | Surface tension AND Surface mount packaging | |
| tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 003 | |
| contenttype | Fulltext | |