Maximizing Electronic System Reliability Through Optimized Distribution of System CoolantSource: Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004::page 345Author:S. M. Miner
DOI: 10.1115/1.2904388Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A mathematical technique for maximizing the reliability in a parallel flow system of electronic units is presented. The failure rate is used as the measure of reliability, and reliability is maximized when the failure rate is minimized. An expression for the system failure rate as a function of individual unit flow rates is derived. This expression, subject to the constraint that the sum of the individual unit flows must equal the system flow rate, forms the basis for this analysis. The method of Lagrange multipliers is applied to minimize the failure rate and determine the optimum distribution of flow within the system. Comparisons are made to failure rates for two other flow distributions. 1. Flow based on maximum allowable junction temperature. 2. Flow proportional to unit power dissipation.
keyword(s): Reliability , Coolants AND Electronic systems ,
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contributor author | S. M. Miner | |
date accessioned | 2017-05-08T23:32:20Z | |
date available | 2017-05-08T23:32:20Z | |
date copyright | December, 1990 | |
date issued | 1990 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26119#345_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/106749 | |
description abstract | A mathematical technique for maximizing the reliability in a parallel flow system of electronic units is presented. The failure rate is used as the measure of reliability, and reliability is maximized when the failure rate is minimized. An expression for the system failure rate as a function of individual unit flow rates is derived. This expression, subject to the constraint that the sum of the individual unit flows must equal the system flow rate, forms the basis for this analysis. The method of Lagrange multipliers is applied to minimize the failure rate and determine the optimum distribution of flow within the system. Comparisons are made to failure rates for two other flow distributions. 1. Flow based on maximum allowable junction temperature. 2. Flow proportional to unit power dissipation. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Maximizing Electronic System Reliability Through Optimized Distribution of System Coolant | |
type | Journal Paper | |
journal volume | 112 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2904388 | |
journal fristpage | 345 | |
journal lastpage | 349 | |
identifier eissn | 1043-7398 | |
keywords | Reliability | |
keywords | Coolants AND Electronic systems | |
tree | Journal of Electronic Packaging:;1990:;volume( 112 ):;issue: 004 | |
contenttype | Fulltext |