Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical TechniquesSource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 157Author:E. Suhir
DOI: 10.1115/1.3226522Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a model is developed, the role of mathematics, what can be gained by using theoretical modeling, as well as the interaction of analytical, numerical (computer-aided) and experimental models. Peculiarities of theoretical modeling in Structural Analysis are also briefly discussed.
keyword(s): Electronic packaging , Modeling , Structural analysis AND Computer-aided engineering ,
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| contributor author | E. Suhir | |
| date accessioned | 2017-05-08T23:29:45Z | |
| date available | 2017-05-08T23:29:45Z | |
| date copyright | June, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26108#157_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105264 | |
| description abstract | We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a model is developed, the role of mathematics, what can be gained by using theoretical modeling, as well as the interaction of analytical, numerical (computer-aided) and experimental models. Peculiarities of theoretical modeling in Structural Analysis are also briefly discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226522 | |
| journal fristpage | 157 | |
| journal lastpage | 161 | |
| identifier eissn | 1043-7398 | |
| keywords | Electronic packaging | |
| keywords | Modeling | |
| keywords | Structural analysis AND Computer-aided engineering | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
| contenttype | Fulltext |