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    Thermal Analysis of a New IMPATT Semiconductor Device

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 135
    Author:
    A. A. Tseng
    DOI: 10.1115/1.3226518
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In many cases, functions of semiconductor devices are limited by thermal rather than electronic considerations. A microcomputer code has been developed to analyze the steady-state thermal behavior of a new multilayered IMPATT device. A two-step modeling approach which can reduce the computer memory needed for computation was employed to allow the present study to be conducted in a microcomputer. The new device was originally designed for electronic purposes. However, the present study found that the multilayer design can provide a favorable thermal environment to improve the heat dissipation rate. The present results also indicate that an increase of the operating frequency increases the thermal resistance which is consistent with most observations. Since the detailed information on temperature distributions throughout the device as well as the proposed packaging (heat sink) is available, the present study can contribute not only to better understanding of the device’s thermal characteristics but also to better design of the packaging.
    keyword(s): Semiconductors (Materials) , Thermal analysis , Packaging , Design , Modeling , Computers , Computation , Functions , Heat sinks , Steady state , Temperature distribution , Heat , Thermal resistance AND Energy dissipation ,
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      Thermal Analysis of a New IMPATT Semiconductor Device

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105261
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    contributor authorA. A. Tseng
    date accessioned2017-05-08T23:29:45Z
    date available2017-05-08T23:29:45Z
    date copyrightJune, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26108#135_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105261
    description abstractIn many cases, functions of semiconductor devices are limited by thermal rather than electronic considerations. A microcomputer code has been developed to analyze the steady-state thermal behavior of a new multilayered IMPATT device. A two-step modeling approach which can reduce the computer memory needed for computation was employed to allow the present study to be conducted in a microcomputer. The new device was originally designed for electronic purposes. However, the present study found that the multilayer design can provide a favorable thermal environment to improve the heat dissipation rate. The present results also indicate that an increase of the operating frequency increases the thermal resistance which is consistent with most observations. Since the detailed information on temperature distributions throughout the device as well as the proposed packaging (heat sink) is available, the present study can contribute not only to better understanding of the device’s thermal characteristics but also to better design of the packaging.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Analysis of a New IMPATT Semiconductor Device
    typeJournal Paper
    journal volume111
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226518
    journal fristpage135
    journal lastpage142
    identifier eissn1043-7398
    keywordsSemiconductors (Materials)
    keywordsThermal analysis
    keywordsPackaging
    keywordsDesign
    keywordsModeling
    keywordsComputers
    keywordsComputation
    keywordsFunctions
    keywordsHeat sinks
    keywordsSteady state
    keywordsTemperature distribution
    keywordsHeat
    keywordsThermal resistance AND Energy dissipation
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002
    contenttypeFulltext
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