Thermal Analysis of a New IMPATT Semiconductor DeviceSource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 135Author:A. A. Tseng
DOI: 10.1115/1.3226518Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In many cases, functions of semiconductor devices are limited by thermal rather than electronic considerations. A microcomputer code has been developed to analyze the steady-state thermal behavior of a new multilayered IMPATT device. A two-step modeling approach which can reduce the computer memory needed for computation was employed to allow the present study to be conducted in a microcomputer. The new device was originally designed for electronic purposes. However, the present study found that the multilayer design can provide a favorable thermal environment to improve the heat dissipation rate. The present results also indicate that an increase of the operating frequency increases the thermal resistance which is consistent with most observations. Since the detailed information on temperature distributions throughout the device as well as the proposed packaging (heat sink) is available, the present study can contribute not only to better understanding of the device’s thermal characteristics but also to better design of the packaging.
keyword(s): Semiconductors (Materials) , Thermal analysis , Packaging , Design , Modeling , Computers , Computation , Functions , Heat sinks , Steady state , Temperature distribution , Heat , Thermal resistance AND Energy dissipation ,
|
Collections
Show full item record
contributor author | A. A. Tseng | |
date accessioned | 2017-05-08T23:29:45Z | |
date available | 2017-05-08T23:29:45Z | |
date copyright | June, 1989 | |
date issued | 1989 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26108#135_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105261 | |
description abstract | In many cases, functions of semiconductor devices are limited by thermal rather than electronic considerations. A microcomputer code has been developed to analyze the steady-state thermal behavior of a new multilayered IMPATT device. A two-step modeling approach which can reduce the computer memory needed for computation was employed to allow the present study to be conducted in a microcomputer. The new device was originally designed for electronic purposes. However, the present study found that the multilayer design can provide a favorable thermal environment to improve the heat dissipation rate. The present results also indicate that an increase of the operating frequency increases the thermal resistance which is consistent with most observations. Since the detailed information on temperature distributions throughout the device as well as the proposed packaging (heat sink) is available, the present study can contribute not only to better understanding of the device’s thermal characteristics but also to better design of the packaging. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Analysis of a New IMPATT Semiconductor Device | |
type | Journal Paper | |
journal volume | 111 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.3226518 | |
journal fristpage | 135 | |
journal lastpage | 142 | |
identifier eissn | 1043-7398 | |
keywords | Semiconductors (Materials) | |
keywords | Thermal analysis | |
keywords | Packaging | |
keywords | Design | |
keywords | Modeling | |
keywords | Computers | |
keywords | Computation | |
keywords | Functions | |
keywords | Heat sinks | |
keywords | Steady state | |
keywords | Temperature distribution | |
keywords | Heat | |
keywords | Thermal resistance AND Energy dissipation | |
tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
contenttype | Fulltext |