An Overview of Integrated Circuit Device EncapsulantsSource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002::page 97Author:C. P. Wong
DOI: 10.1115/1.3226528Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants.
keyword(s): Integrated circuits , Electronics , Dimensions , Manufacturing , Design AND Polymers ,
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contributor author | C. P. Wong | |
date accessioned | 2017-05-08T23:29:45Z | |
date available | 2017-05-08T23:29:45Z | |
date copyright | June, 1989 | |
date issued | 1989 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26108#97_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105255 | |
description abstract | The rapid development of integrated circuit technology from small-scale integration (SSI) to very large scale integration (VLSI) has had great technological and economical impact on the electronics industry. The exponential growth of the number of components per IC chip, the exponential decrease of device dimensions, and the steady increase in IC chip size have imposed stringent requirements, not only on the IC physical design and fabrication, but also on IC encapsulants. This report addresses the purpose of encapsulation, encapsulation techniques, and a general overview of the application of inorganic and organic polymer materials as electronic device encapsulants. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Overview of Integrated Circuit Device Encapsulants | |
type | Journal Paper | |
journal volume | 111 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.3226528 | |
journal fristpage | 97 | |
journal lastpage | 107 | |
identifier eissn | 1043-7398 | |
keywords | Integrated circuits | |
keywords | Electronics | |
keywords | Dimensions | |
keywords | Manufacturing | |
keywords | Design AND Polymers | |
tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
contenttype | Fulltext |