contributor author | P. A. Engel | |
contributor author | D. H. Strope | |
contributor author | T. E. Wray | |
date accessioned | 2017-05-08T23:29:45Z | |
date available | 2017-05-08T23:29:45Z | |
date copyright | June, 1989 | |
date issued | 1989 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26108#90_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105254 | |
description abstract | In metallized ceramic technology substantial mechanical stresses arise in assembly, insertion and cyclic thermal loading of thermally enhanced modules. This paper describes some experimental and analytical investigations performed for safeguarding the structural integrity of modules in which heat conduction from the chip to the module cap was enhanced by a “thermal grease” compound. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Mechanical Analysis for Thermal Grease Enhanced Modules Enclosing a Silicon Chip | |
type | Journal Paper | |
journal volume | 111 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.3226527 | |
journal fristpage | 90 | |
journal lastpage | 96 | |
identifier eissn | 1043-7398 | |
keywords | Ceramics | |
keywords | Manufacturing | |
keywords | Heat conduction | |
keywords | Stress AND Silicon chips | |
tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 002 | |
contenttype | Fulltext | |