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    Experimental Modeling of Convection Downstream from an Electronic Package Row

    Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003::page 207
    Author:
    R. A. Wirtz
    ,
    W. McAuliffe
    DOI: 10.1115/1.3226535
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Experiments on convective heat transfer in the wake of a row of closely spaced pin-mount packages are reported. Flow visualization and interferometric heat transfer measurements are made in an induced draft wind tunnel where the package row is modeled with a two-dimensional transverse rib attached to one channel wall. The transverse rib has an aspect ratio of 5.25:1.0, and the channel height-to-rib height ratio is 4.0:1.0. Results are reported for coolant Reynolds numbers ranging from 1000 to 4000. Flow visualization shows the wake region to be similar to flow past a simple back step. Recirculating flow is found to extend from nine to three rib heights downstream from the rib, depending on the magnitude of the flow Reynolds number. Local heat transfer within this region is reduced relative to what would occur in the absence of the transverse rib, with average values of the heat transfer coefficient bracketed between laminar and turbulent correlations for simple back steps. Heat transfer rates further downstream, after reattachment of the flow, are in excess of those expected for flow with no transverse rib.
    keyword(s): Convection , Modeling , Electronic packages , Flow (Dynamics) , Heat transfer , Channels (Hydraulic engineering) , Reynolds number , Flow visualization , Wakes , Coolants , Measurement , Turbulence , Wind tunnels AND Heat transfer coefficients ,
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      Experimental Modeling of Convection Downstream from an Electronic Package Row

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    http://yetl.yabesh.ir/yetl1/handle/yetl/105243
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    contributor authorR. A. Wirtz
    contributor authorW. McAuliffe
    date accessioned2017-05-08T23:29:43Z
    date available2017-05-08T23:29:43Z
    date copyrightSeptember, 1989
    date issued1989
    identifier issn1528-9044
    identifier otherJEPAE4-26110#207_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/105243
    description abstractExperiments on convective heat transfer in the wake of a row of closely spaced pin-mount packages are reported. Flow visualization and interferometric heat transfer measurements are made in an induced draft wind tunnel where the package row is modeled with a two-dimensional transverse rib attached to one channel wall. The transverse rib has an aspect ratio of 5.25:1.0, and the channel height-to-rib height ratio is 4.0:1.0. Results are reported for coolant Reynolds numbers ranging from 1000 to 4000. Flow visualization shows the wake region to be similar to flow past a simple back step. Recirculating flow is found to extend from nine to three rib heights downstream from the rib, depending on the magnitude of the flow Reynolds number. Local heat transfer within this region is reduced relative to what would occur in the absence of the transverse rib, with average values of the heat transfer coefficient bracketed between laminar and turbulent correlations for simple back steps. Heat transfer rates further downstream, after reattachment of the flow, are in excess of those expected for flow with no transverse rib.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleExperimental Modeling of Convection Downstream from an Electronic Package Row
    typeJournal Paper
    journal volume111
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.3226535
    journal fristpage207
    journal lastpage212
    identifier eissn1043-7398
    keywordsConvection
    keywordsModeling
    keywordsElectronic packages
    keywordsFlow (Dynamics)
    keywordsHeat transfer
    keywordsChannels (Hydraulic engineering)
    keywordsReynolds number
    keywordsFlow visualization
    keywordsWakes
    keywordsCoolants
    keywordsMeasurement
    keywordsTurbulence
    keywordsWind tunnels AND Heat transfer coefficients
    treeJournal of Electronic Packaging:;1989:;volume( 111 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian