A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element MethodsSource: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004::page 313Author:J. H. Lau
DOI: 10.1115/1.3226554Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to obtain the correct thermal stresses is recommended.
keyword(s): Electronic packaging , Thermal stresses , Finite element methods , Errors AND Composite materials ,
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| contributor author | J. H. Lau | |
| date accessioned | 2017-05-08T23:29:41Z | |
| date available | 2017-05-08T23:29:41Z | |
| date copyright | December, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26113#313_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105233 | |
| description abstract | The purpose of this paper is to point out a very common mistake made in determining the thermal stresses in composite structures by finite element methods. Furthermore, a simple technique to obtain the correct thermal stresses is recommended. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Note on the Calculation of Thermal Stresses in Electronic Packaging by Finite Element Methods | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226554 | |
| journal fristpage | 313 | |
| journal lastpage | 320 | |
| identifier eissn | 1043-7398 | |
| keywords | Electronic packaging | |
| keywords | Thermal stresses | |
| keywords | Finite element methods | |
| keywords | Errors AND Composite materials | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004 | |
| contenttype | Fulltext |