Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?Source: Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004::page 310Author:E. Suhir
DOI: 10.1115/1.3226553Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling.
keyword(s): Temperature , Solder joints AND Fatigue life ,
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| contributor author | E. Suhir | |
| date accessioned | 2017-05-08T23:29:41Z | |
| date available | 2017-05-08T23:29:41Z | |
| date copyright | December, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26113#310_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105232 | |
| description abstract | We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected to power cycling. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests? | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226553 | |
| journal fristpage | 310 | |
| journal lastpage | 312 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Solder joints AND Fatigue life | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004 | |
| contenttype | Fulltext |