| contributor author | J. H. Lau | |
| contributor author | L. B. Lian-Mueller | |
| date accessioned | 2017-05-08T23:29:39Z | |
| date available | 2017-05-08T23:29:39Z | |
| date copyright | December, 1989 | |
| date issued | 1989 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26113#255_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/105222 | |
| description abstract | The thermal stresses in microwave packages are studied by the finite element method. Emphasis is placed on the effects of material construction and design on the reliability of very small hermetic packages. Three different microwave packages have been designed and six finite element models (two for each design) have been analyzed. To verify the validity of the finite element results, some leak tests have been performed and the results agree with the analytical conclusions. The results presented herein should provide a better understanding of the thermal behavior of hermetic packages and should be useful for their optimal design. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Finite Element Modeling for Optimizing Hermetic Package Reliability | |
| type | Journal Paper | |
| journal volume | 111 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.3226544 | |
| journal fristpage | 255 | |
| journal lastpage | 260 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Finite element analysis | |
| keywords | Modeling | |
| keywords | Design | |
| keywords | Microwaves | |
| keywords | Finite element model | |
| keywords | Leakage | |
| keywords | Construction | |
| keywords | Thermal stresses AND Finite element methods | |
| tree | Journal of Electronic Packaging:;1989:;volume( 111 ):;issue: 004 | |
| contenttype | Fulltext | |