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RISCBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Three-dimensional nonlinear finite element analysis of a ceramic ball grid array (CBGA) package was conducted to determine the solder joint creep and plastic strain deformations in a simulated ...
A New Creep Constitutive Model for Eutectic Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. ...
Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature ...
Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185]
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: [S1043-7398(00)01601-7]
Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the ...