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RISNotes on the ASME International Electronics Packaging Conference
Publisher: The American Society of Mechanical Engineers (ASME)
Structural Analysis in Microelectronics
Publisher: The American Society of Mechanical Engineers (ASME)
Tribology and Mechanics of Magnetic Storage Devices
Publisher: The American Society of Mechanical Engineers (ASME)
General Microhardness Indentation Theory for Multilayer Contacts
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A refined method for interpreting the Vickers composite microhardness measurement for multilayer materials having layers of arbitrary plating thickness is first presented. The position of an ...
Thermal Stress and Strain in Microelectronics Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Structural Analysis of Printed Circuit Board Systems
Publisher: The American Society of Mechanical Engineers (ASME)
Thermal Stress Analysis of Pin Grid Array Structures: Pin and Solder Joint Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The role of the solder joint as an elastic foundation is investigated first for structural analysis of the pin. Failure mechanisms are discussed. For various pin cross sections, guidelines for ...
Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In an earlier work [1], thermal stresses in soldered pins were calculated under the assumption of an elastically deforming solder barrel. In the present analysis, the nonlinear,temperature dependent ...
Solder Joint Reliability—Theory and Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Impact Wear of Materials
Publisher: The American Society of Mechanical Engineers (ASME)