Abstract: By simulating the movement of a node in a tree, an iso-distance error graph (IDEG) which contains connection errors generated by replacing a Steiner tree with its equivalent non-Steiner tree ...

Abstract: Environmental Scanning Electron Microscopy (E-SEM) is a technique which provides the capability to investigate surface morphologies over a variety of controllable environmental conditions. This paper ...

Abstract: GaAs is known to have superior electronic properties and greater photovoltaic conversion efficiency compared to elemental semiconductors such as silicon and germaniumn. Mechanical properties of ...

Abstract: A zonal decomposition technique is developed for temperature field and flux determination at both aligned and nonaligned grid interface boundaries. The method facilitates heat transfer problems ...

Abstract: Book Review: Handbook of Electronic Package Design , edited by Michael Pecht, Marcel-Dekker, Inc. New York, NY, 1991, 871 pp. (Hard Bound), ISBN: 0-8247-7921-5, $245.00. REVIEWED BY: ANTHONY J. RAFANELLI...

Abstract: One possible failure mechanism of products containing polyimide dielectric is deadhesion of polyimide from neighboring metallization. Deadhesion usually occurs due to the combined damage mechanisms ...

Abstract: Wire bond connections are susceptible to fatigue failure as a result of various thermo-mechanical damage mechanisms during the component operation life. Because of uncertainties arising from the ...