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RISThermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This special issue includes selected papers presented at the International Conference of Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Paris, May ...
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In microelectronic industry, thin polymer layers are one of the more commonly used product constituents. Examples are glue layers, coatings, and dielectric layers. The thicknesses of these films ...
Finite Thickness Influence on Spherical and Conical Indentation on Viscoelastic Thin Polymer Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The thermo-mechanical integration of polymer films requires a precise knowledge of material properties. Nanoindentation is a widely used testing method for the determination of material properties ...
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected ...
Response Surface Modeling for Nonlinear Packaging Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The present study focuses on the development of reliable response surface models (RSM’s) for the major packaging processes of a typical electronic package. The major objective is to optimize ...
Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For reliable virtual thermo-mechanical prototyping of electronic packages appropriate descriptions of the mechanical behavior of the constituent materials are essential. In many packages molding ...
Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Interface delamination failure caused by thermomechanical loading and mismatch of thermal expansion coefficients and other material properties is one of the important failure modes occurring in ...
Solders Fatigue Prediction Using Interfacial Boundary Volume Criterion
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, an “interfacial boundary volume” based damage criterion was proposed in combination with the modified Coffin-Manson model to predict solder fatigue. This criterion assumes that ...
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigates the effect of the anisotropic behavior of the die and the time- and temperature-dependent behavior of epoxy molding compound on the packaging induced stresses for a quad ...
Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is ...