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Molecular Dynamics Simulation of Phonon Scattering at Silicon/Germanium Interfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Detailed phonon transport at Si/Ge interfaces is studied using the molecular dynamics wave-packet method. Three types of interfaces are investigated: A smooth interface, an interface with random ...
Phonon Transport Modeling Using Boltzmann Transport Equation With Anisotropic Relaxation Times
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A sub-micron thermal transport model based on the phonon Boltzmann transport equation (BTE) is developed using anisotropic relaxation times. A previously-published model, the full-scattering model, ...
A Meshless Finite Difference Method for Conjugate Heat Conduction Problems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A meshless finite difference method is developed for solving conjugate heat transfer problems. Starting with an arbitrary distribution of mesh points, derivatives are evaluated using a weighted ...
Computational Heat Transfer in Complex Systems: A Review of Needs and Opportunities
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: During the few decades, computational techniques for simulating heat transfer in complex industrial systems have reached maturity. Combined with increasingly sophisticated modeling of turbulence, ...
Microscale Temperature Measurements Near the Triple Line of an Evaporating Thin Liquid Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thin-film evaporation from a meniscus in a confined space, which is the basis for many two-phase cooling devices, is experimentally investigated. The meniscus formed by heptane, a highly wetting ...
Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this study, numerical investigations are performed to examine the influence of unsteady submerged dielectric liquid (HFE-8401HT) jets impinging on electronic chip surfaces. The problem considered ...
Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The topology and geometry of microstructures play a crucial role in determining their heat transfer performance in passive cooling devices such as heat pipes. It is therefore important to ...
Marangoni Convection and Thin-Film Evaporation in Microstructured Wicks for Heat Pipes
Publisher: The American Society of Mechanical Engineers (ASME)
Simulation of Thermal Transport in Open-Cell Metal Foams: Effect of Periodic Unit-Cell Structure
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Direct simulation of thermal transport in open-cell metal foams is conducted using different periodic unit-cell geometries. The periodic unit-cell structures are constructed by assuming the pore ...
Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: We report finite-volume simulations of the phonon Boltzmann transport equation (BTE) for heat conduction across the heterogeneous interfaces in SiGe superlattices. The diffuse mismatch model ...