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    Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures

    Source: Journal of Heat Transfer:;2009:;volume( 131 ):;issue: 010::page 101001
    Author:
    Ram Ranjan
    ,
    Jayathi Y. Murthy
    ,
    Suresh V. Garimella
    DOI: 10.1115/1.3160538
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The topology and geometry of microstructures play a crucial role in determining their heat transfer performance in passive cooling devices such as heat pipes. It is therefore important to characterize microstructures based on their wicking performance, the thermal conduction resistance of the liquid filling the microstructure, and the thin-film characteristics of the liquid meniscus. In the present study, the free-surface shapes of the static liquid meniscus in common microstructures are modeled using SURFACE EVOLVER for zero Bond number. Four well-defined topologies, viz., surfaces with parallel rectangular ribs, horizontal parallel cylinders, vertically aligned cylinders, and spheres (the latter two in both square and hexagonal packing arrangements), are considered. Nondimensional capillary pressure, average distance of the liquid free-surface from solid walls (a measure of the conduction resistance of the liquid), total exposed area, and thin-film area are computed. These performance parameters are presented as functions of the nondimensional geometrical parameters characterizing the microstructures, the volume of the liquid filling the structure, and the contact angle between the liquid and solid. Based on these performance parameters, hexagonally-packed spheres on a surface are identified to be the most efficient microstructure geometry for wicking and thin-film evaporation. The solid-liquid contact angle and the nondimensional liquid volume that yield the best performance are also identified. The optimum liquid level in the wick pore that yields the highest capillary pressure and heat transfer is obtained by analyzing the variation in capillary pressure and heat transfer with liquid level and using an effective thermal resistance model for the wick.
    keyword(s): Pressure , Thin films , Heat transfer , Evaporation , Shapes , Heat conduction , Electrical resistance , Topology , Porosity AND Thermal resistance ,
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      Analysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures

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    http://yetl.yabesh.ir/yetl1/handle/yetl/140953
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    contributor authorRam Ranjan
    contributor authorJayathi Y. Murthy
    contributor authorSuresh V. Garimella
    date accessioned2017-05-09T00:33:35Z
    date available2017-05-09T00:33:35Z
    date copyrightOctober, 2009
    date issued2009
    identifier issn0022-1481
    identifier otherJHTRAO-27872#101001_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/140953
    description abstractThe topology and geometry of microstructures play a crucial role in determining their heat transfer performance in passive cooling devices such as heat pipes. It is therefore important to characterize microstructures based on their wicking performance, the thermal conduction resistance of the liquid filling the microstructure, and the thin-film characteristics of the liquid meniscus. In the present study, the free-surface shapes of the static liquid meniscus in common microstructures are modeled using SURFACE EVOLVER for zero Bond number. Four well-defined topologies, viz., surfaces with parallel rectangular ribs, horizontal parallel cylinders, vertically aligned cylinders, and spheres (the latter two in both square and hexagonal packing arrangements), are considered. Nondimensional capillary pressure, average distance of the liquid free-surface from solid walls (a measure of the conduction resistance of the liquid), total exposed area, and thin-film area are computed. These performance parameters are presented as functions of the nondimensional geometrical parameters characterizing the microstructures, the volume of the liquid filling the structure, and the contact angle between the liquid and solid. Based on these performance parameters, hexagonally-packed spheres on a surface are identified to be the most efficient microstructure geometry for wicking and thin-film evaporation. The solid-liquid contact angle and the nondimensional liquid volume that yield the best performance are also identified. The optimum liquid level in the wick pore that yields the highest capillary pressure and heat transfer is obtained by analyzing the variation in capillary pressure and heat transfer with liquid level and using an effective thermal resistance model for the wick.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalysis of the Wicking and Thin-Film Evaporation Characteristics of Microstructures
    typeJournal Paper
    journal volume131
    journal issue10
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.3160538
    journal fristpage101001
    identifier eissn1528-8943
    keywordsPressure
    keywordsThin films
    keywordsHeat transfer
    keywordsEvaporation
    keywordsShapes
    keywordsHeat conduction
    keywordsElectrical resistance
    keywordsTopology
    keywordsPorosity AND Thermal resistance
    treeJournal of Heat Transfer:;2009:;volume( 131 ):;issue: 010
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian