Search
CSV
RISPull Force and Displacement of Cu/Au Wire Interconnects
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for ...
Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element ...
Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal stresses and strains in the solder joints and plated-through-hole (PTH) copper pads/barrels of a pin-grid array (PGA) assembly under thermal cycling conditions have been determined in the ...
Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a semi-implicit time integration scheme has been developed for a damage-coupled constitutive model to characterize the mechanical behavior of 63Sn-37Pb solder material under ...
Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effect of heat-spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost-effective cavity-down plastic ball grid array (PBGA) packages assembled ...
Robust Fixture Configuration Design for Sheet Metal Assembly With Laser Welding
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fixturing plays an important role in the quality of metal fit-up for sheet metal assembly with laser welding. To reduce the sensitivity of the designed fixture configuration to location ...
Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed circuit boards populated with twenty-five 0.4 mm pitch, 256-pin plastic quad flat packs (QFP) containing no-clean and water-clean solder joints were subjected to thermal cycling in order ...
Behavior of Lead-Free Solder Under Thermomechanical Loading
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents an investigation of lead-free Sn-Ag base alloy, 95.5Sn-3.9Ag-0.6Cu, both experimentally and analytically. Experimentally, the deformation behavior of the material was measured ...
Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination ...
Solder Joint Reliability of Surface Mount Connectors
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The solder joint reliability of five different surface mount connectors has been studied by eleven different experimental methods. A set of test methods and specifications for determining the ...