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    A New Creep Constitutive Model for Eutectic Solder Alloy 

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002:;page 85
    Author(s): X. Q. Shi; W. Zhou; Q. J. Yang; H. L. J. Pang; Z. P. Wang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, a large number of creep tests were carried out to study the effect of stress level and testing temperature on the creep behavior of 63 Sn/37Pb solder in a systematic manner. ...
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    Creep Behavior and Deformation Mechanism Map of Sn-Pb Eutectic Solder Alloy 

    Source: Journal of Engineering Materials and Technology:;2003:;volume( 125 ):;issue: 001:;page 81
    Author(s): X. Q. Shi; H. L. J. Pang; Z. P. Wang; Q. J. Yang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature ...
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    Erratum: “Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy” [ASME J. Electron. Packag., 121, pp. 179–185] 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001:;page 74
    Author(s): X. Q. Shi; W. Zhou; H. L. J. Pang; Z. P. Wang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: [S1043-7398(00)01601-7]
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    Effect of Temperature and Strain Rate on Mechanical Properties of 63Sn/37Pb Solder Alloy 

    Source: Journal of Electronic Packaging:;1999:;volume( 121 ):;issue: 003:;page 179
    Author(s): X. Q. Shi; W. Zhou; Z. P. Wang; H. L. J. Pang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this study, tensile tests of 63Sn/37Pb solder were carried out at various strain rates from 10−5 s−1 to 10−1 s−1 over a wide temperature range from −40°C to 125°C to study the ...
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