Abstract: A simple analytical (“mathematical”) predictive model is developed with an objective to establish the condition of elastic stability for a compressed cantilever beam (rod) of finite length lying ...

Abstract: A die-carrier assembly, subjected to the external tensile forces and bending moments applied to the flexible carrier is considered. The objective of the analysis is to develop a simple, ...

Abstract: Compliant external electrical leads are often utilized as strain buffers in surface-mounted device technology to provide the necessary stress relief for the device, when the substrate is subjected ...

Abstract: Twist-off testing of solder joint interconnections is regarded by many reliability engineers in the microelectronic industry as an attractive alternative to shear-off testing. In this paper we ...

Abstract: Thin plastic packages are prone to residual bows caused by the thermal contraction mismatch of the constituent materials: silicon (chip), metal (leadframe), and epoxy (encapsulant). Since excessive ...

Abstract: We evaluate the nonlinear dynamic response of a flexible printed circuit board (PCB) to the following two types of shock loads acting on its support contour: 1) suddenly applied constant ...

Abstract: We discuss how temperature cycling test conditions could be modified to be used for a tentative evaluation of the fatigue life of solder joint interconnections in surface mounted devices subjected ...

Abstract: In this analysis we suggest a simple engineering method for the evaluation of the interfacial stresses in elongated bimaterial plates subjected to bending. The taken approach enables one to ...

Abstract: We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a ...