Abstract: A surface-mount J-leaded device is modeled in this study, to investigate the effects of selected design, loading and manufacturing variables on solder joint fatigue life. The solder is modeled ...

Abstract: This study explores the possibility of using a unified theory of creep-fatigue, similar to the Halford-Manson strain-range partitioning method, for examining the effect of cyclic temperature range ...

Abstract: During a typical wave soldering operation a plated through hole (PTH) is exposed to temperatures which are higher than any rated operating temperatures. Understanding the heat transfer and the ...

Abstract: Thermomechanical properties of low temperature cofired ceramic substrates in the range of operational temperatures are necessary to incorporate into the design models for multichip modules and ...

Abstract: The combined effects of elastic and inelastic strains on solder joint reliability are investigated. Experimental data from high-cycle fatigue tests of solder are combined with data from low-cycle ...

Abstract: Failure of plated-through-holes (PTHs) due to thermomechanical stresses is a well established cause of failure of multilayer printed wiring boards (MLBs). This paper uses the finite element method ...