Abstract: Surface microchannels can accelerate squeezing flow of a fluid in a thin gap between parallel plates. Using a computational model and restricting attention to power law fluid, a parametric study ...

Abstract: Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This ...

Abstract: This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By ...

Abstract: The current paper presents the results of an analytical study of steady state heat conduction in a rectangular tube with eccentric hot spots on both the top and the bottom surfaces. The ...

Abstract: A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal ...

Abstract: Since its inception 20 years ago, ITherm, The Intersociety Conference on Thermal, Mechanical, and Thermomechanical Phenomena in Electronic Systems, has been addressing recent advances in the area ...

Abstract: This paper presents a performance study done on a semiconductor laser diode in a moisture condensing environment. Devices with laser diodes are used in a wide variety of electronic applications ...

Abstract: The presence of bacterial biofilms is detrimental in a wide range of healthcare situations especially wound healing. Physical debridement of biofilms is a method widely used to remove them. ...

Abstract: This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages ...