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    Squeezing Flow of a Power Law Fluid Between Grooved Plates 

    Source: Journal of Electronic Packaging:;2009:;volume( 131 ):;issue: 003:;page 31007
    Author(s): Drew A. Davidson; Bahgat G. Sammakia
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Surface microchannels can accelerate squeezing flow of a fluid in a thin gap between parallel plates. Using a computational model and restricting attention to power law fluid, a parametric study ...
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    Letter From the Editors 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003:;page 30201
    Author(s): Sammakia, Bahgat G.; Lee, Y. C.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: During the last ten years, it was a great pleasure working with the many outstanding AEs who served the JEP, the ASME staff, and with Mr. Gary Miller. Thanks to all of us working as a team, we were able to get the JEP to ...
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    An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages 

    Source: Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001:;page 11007
    Author(s): Sushma Madduri; William Infantolino; Bahgat.G Sammakia
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Moisture induced epoxy swelling is a potential failure mechanism in nonhermetic packages. Epoxy materials used in the package absorb moisture and swell in a relatively humid environment. This ...
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    A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package 

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002:;page 107
    Author(s): Sanjeev B. Sathe; Bahgat G. Sammakia
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper deals with the thermal management of a TBGA chip carrier package. In TBGA packages the backside of the chip is available for heat sink or heat spreader (cover plate) attach. By ...
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    Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment 

    Source: Journal of Electronic Packaging:;2015:;volume( 137 ):;issue: 002:;page 21010
    Author(s): Alkharabsheh, Sami A.; Sammakia, Bahgat G.; Shrivastava, Saurabh K.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper presents the results of an experimentally validated computational fluid dynamics (CFD) model for a data center with fully implemented fan curves on both the servers and the computer room air conditioner (CRAC). ...
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    Heat Conduction in a Rectangular Tube With Eccentric Hot Spots 

    Source: Journal of Thermal Science and Engineering Applications:;2011:;volume( 003 ):;issue: 004:;page 41002
    Author(s): Bo Dan; James F. Geer; Bahgat G. Sammakia
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The current paper presents the results of an analytical study of steady state heat conduction in a rectangular tube with eccentric hot spots on both the top and the bottom surfaces. The ...
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    Optimization Study for a Parallel Plate Impingement Heat Sink 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004:;page 311
    Author(s): Amit Shah; Bahgat G. Sammakia; K. Ramakrishna; K. Srihari
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A previous study by the authors on fin-shape optimization of a plate fin heat sink has concluded that a depopulated central zone, just under the center of the fan, provides a better thermal ...
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    Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density 

    Source: Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 003:;page 31006
    Author(s): Zhang, Tingting; Sammakia, Bahgat G.; Yang, Zhihao; Wang, Howard
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network ...
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    Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology 

    Source: Journal of Electronic Packaging:;2022:;volume( 144 ):;issue: 003:;page 31015-1
    Author(s): Tradat, Mohammad I.; Manaserh, Yaman “Mohammad Ali”; Gharaibeh, Ahmad; Sammakia, Bahgat G.; Hall, Dave; Nemati, Kourosh; Seymour, Mark
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An increasingly common power saving practice in data center thermal management is to swap out air cooling unit blower fans with electronically commutated plug fans, Although, both are centrifugal blowers. The blade design ...
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    Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators 

    Source: Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004:;page 41004
    Author(s): Xu, Xinqiang; Zhou, Siyi; Meyers, Mark M.; Sammakia, Bahgat G.; Murray, Bruce T.
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Thermoelectric (TE) modules utilize available temperature differences to generate electricity by the Seebeck effect. The current study investigates the merits of employing thermoelectrics to harvest additional electric ...
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    DSpace software copyright © 2002-2015  DuraSpace
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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