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    State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment 

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 003:;page 257
    Author(s): Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The incessant improvements in IC technology have made it possible to conceptualize “information appliances” providing nearly unimaginable scalar, vector, and massively parallel information processing ...
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    “Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink 

    Source: Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002:;page 172
    Author(s): Suzana Prstic; Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The inherent advantages of forced air cooling have led to the widespread use of fully and partially shrouded heat sinks for the thermal management of high power microprocessors. The superior ...
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    IR Thermography of Two-Phase Microgap Cooler 

    Source: Journal of Heat Transfer:;2011:;volume( 133 ):;issue: 008:;page 80908
    Author(s): Jessica Sheehan; Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Thermal Management of On-Chip Hot Spot 

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 005:;page 51017
    Author(s): Avram Bar-Cohen; Peng Wang
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over ...
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    Optimization of Pool Boiling Heat Sinks Including the Effects of Confinement in the Interfin Spaces 

    Source: Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004:;page 41002
    Author(s): Karl J. Geisler; Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A finite element analysis approach is developed and used to efficiently evaluate and optimize the boiling performance of longitudinal rectangular plate fin heat sinks, including the explicit ...
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    Focus on Emerging Technologies 

    Source: Applied Mechanics Reviews:;1991:;volume( 044 ):;issue: 003:;page ii
    Author(s): Avram Bar-Cohen; A. W. Kenneth Metzner
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Design of Optimum Plate-Fin Natural Convective Heat Sinks 

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002:;page 208
    Author(s): Avram Bar-Cohen; Madhusudan Iyengar; Allan D. Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced ...
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    Advances in Thermal Modeling of Electronic Components and System—Vol. 2 

    Source: Journal of Manufacturing Science and Engineering:;1991:;volume( 113 ):;issue: 002:;page 246
    Author(s): Avram Bar-Cohen; V. P. Carey; Allan Kraus
    Publisher: The American Society of Mechanical Engineers (ASME)
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    Energy Efficient Polymers for Gas-Liquid Heat Exchangers 

    Source: Journal of Energy Resources Technology:;2010:;volume( 132 ):;issue: 002:;page 21001
    Author(s): Patrick Luckow; Peter Rodgers; Juan Cevallos; Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The compression process necessary for the liquefaction of natural gas on offshore platforms generates large amounts of heat, usually dissipated via sea water cooled plate heat exchangers. To ...
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    Incorporating Moldability Considerations During the Design of Polymer Heat Exchangers 

    Source: Journal of Mechanical Design:;2011:;volume( 133 ):;issue: 008:;page 81009
    Author(s): Juan Cevallos; S. K. Gupta; Avram Bar-Cohen
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Recently, available formulations of thermally enhanced polymer composites are attractive in heat exchanger applications due to their low cost and improved corrosion resistance compared to the ...
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