contributor author | Avram Bar-Cohen | |
contributor author | Peng Wang | |
date accessioned | 2017-05-09T00:52:19Z | |
date available | 2017-05-09T00:52:19Z | |
date copyright | May, 2012 | |
date issued | 2012 | |
identifier issn | 0022-1481 | |
identifier other | JHTRAO-27940#051017_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/149472 | |
description abstract | The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Management of On-Chip Hot Spot | |
type | Journal Paper | |
journal volume | 134 | |
journal issue | 5 | |
journal title | Journal of Heat Transfer | |
identifier doi | 10.1115/1.4005708 | |
journal fristpage | 51017 | |
identifier eissn | 1528-8943 | |
keywords | Temperature | |
keywords | Cooling | |
keywords | Silicon chips | |
keywords | Heat flux | |
keywords | Thermal management | |
keywords | Heat transfer coefficients | |
keywords | Superlattices | |
keywords | Silicon AND Thickness | |
tree | Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 005 | |
contenttype | Fulltext | |