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    Thermal Management of On-Chip Hot Spot

    Source: Journal of Heat Transfer:;2012:;volume( 134 ):;issue: 005::page 51017
    Author:
    Avram Bar-Cohen
    ,
    Peng Wang
    DOI: 10.1115/1.4005708
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared.
    keyword(s): Temperature , Cooling , Silicon chips , Heat flux , Thermal management , Heat transfer coefficients , Superlattices , Silicon AND Thickness ,
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      Thermal Management of On-Chip Hot Spot

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    http://yetl.yabesh.ir/yetl1/handle/yetl/149472
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    contributor authorAvram Bar-Cohen
    contributor authorPeng Wang
    date accessioned2017-05-09T00:52:19Z
    date available2017-05-09T00:52:19Z
    date copyrightMay, 2012
    date issued2012
    identifier issn0022-1481
    identifier otherJHTRAO-27940#051017_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/149472
    description abstractThe rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Management of On-Chip Hot Spot
    typeJournal Paper
    journal volume134
    journal issue5
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4005708
    journal fristpage51017
    identifier eissn1528-8943
    keywordsTemperature
    keywordsCooling
    keywordsSilicon chips
    keywordsHeat flux
    keywordsThermal management
    keywordsHeat transfer coefficients
    keywordsSuperlattices
    keywordsSilicon AND Thickness
    treeJournal of Heat Transfer:;2012:;volume( 134 ):;issue: 005
    contenttypeFulltext
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