Advances in Thermal Modeling of Electronic Components and System—Vol. 2Source: Journal of Manufacturing Science and Engineering:;1991:;volume( 113 ):;issue: 002::page 246DOI: 10.1115/1.2899688Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Electronic components AND Modeling ,
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| contributor author | Avram Bar-Cohen | |
| contributor author | V. P. Carey | |
| contributor author | Allan Kraus | |
| date accessioned | 2017-05-08T23:36:01Z | |
| date available | 2017-05-08T23:36:01Z | |
| date copyright | May, 1991 | |
| date issued | 1991 | |
| identifier issn | 1087-1357 | |
| identifier other | JMSEFK-27749#246_2.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/108818 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Advances in Thermal Modeling of Electronic Components and System—Vol. 2 | |
| type | Journal Paper | |
| journal volume | 113 | |
| journal issue | 2 | |
| journal title | Journal of Manufacturing Science and Engineering | |
| identifier doi | 10.1115/1.2899688 | |
| journal fristpage | 246 | |
| identifier eissn | 1528-8935 | |
| keywords | Electronic components AND Modeling | |
| tree | Journal of Manufacturing Science and Engineering:;1991:;volume( 113 ):;issue: 002 | |
| contenttype | Fulltext |