Journal of Electronic Packaging: Recent submissions
Now showing items 1-20 of 2123
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Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. This study demonstrates a reliable wafer-level Au/Si eutectic bonding technique suitable for hermetic packaging of MEMS resonators with small cavities (≤0.01 mm3). By optimizing the Au-Si eutectic bonding process, ... -
A Physics-Informed Adaptive Segmentation Fitting Method for Transient Thermal Test Analysis
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Transient thermal testing is a crucial technique for characterizing the thermal properties of semiconductor devices, but measurement noise often compromises its accuracy. Conventional square-root fitting (SRF) ... -
Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure Up to 1 Year Aging
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The reliability of electronic devices is significantly influenced by the fatigue failure of packaging materials under prolonged high-temperature exposure. Epoxy molding compounds (EMCs) are widely used to encapsulate ... -
Characterization of Non-PFAS Underfill Behavior Under Harsh Operating Conditions
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Per- and polyfluoroalkyl substances, or PFAS for convenience, are a group of synthetic chemicals that were first produced in the 1940s and are being widely used across a variety of industries. Their unique ... -
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. In this study, heat transfer and temperature distribution characteristics of an electronic component covered with a porous medium were investigated both experimentally and numerically. An experimental setup was ... -
Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Probe cards play an essential role in wafer testing, with multilayer cantilever designs accommodating the high pin-count requirements of modern IC devices. However, dense probe arrangements increase the risk of ... -
First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Conventional approaches to enhance Ag/Ni contact material performance have involved experimental trial-and-error processes. The research employs computational modeling and experimental verification to investigate ... -
Additively Printed Circuit Performance of Thermoformed In-Mold Electronics for Automotive Applications
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The use of in-mold Electronics has the potential for transforming design and production of automotive systems through greater integration of form and function and lightweighting achieved by elimination of wire ... -
Surge Current Capability of Dual-Chip Packaged SiC Schottky Barrier Diodes
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The surge current capability is one of the important key parameters for the application of silicon carbide (SiC) Schottky barrier diode (SBD) in power converters. A comparison is conducted between the surge current ... -
Comparative Performance Analysis of Screen-Printed Structures on Polyethylene Terephthalate and BPET Substrates Utilizing Low-Temperature Electrically Conductive Adhesive and MACA for Surface Mount Device Component Attachment
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Polyethylene terephthalate (PET) and polymide (PI) are used for the additive fabrication of flexible hybrid electronics (FHE) due to their excellent thermal and dimensional stability and mechanical strength. ... -
Cohesive Zone Modeling of the Polyimide/Silicon Interface in 2.5D Packaging by Nanoindentation Testing
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The polyimide (PI)/silicon (Si) is a critical interface in 2.5D packaging and is highly susceptible to failure due to thermal and mechanical loads. The large thermal expansion mismatch that exists between these ... -
Investigating the Impact of Dynamic Excitation and Boundary Conditions on the Fatigue Life of Board-Level Electronic Packages
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Electronic packages are transitioning from cloud computing (controlled environment) to edge computing (uncontrolled environment), presenting new challenges, especially in high-vibration environments like ... -
Performance Evaluation of Direct Write Thermoformed Additively Printed Silver Circuits With Electrically Conductive Adhesive for in Mold Electronics
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The development of additively printed thermoformable circuitry for in-mold electronics (IME) has garnered immense interest due to its benefits, including flexible design, cost-effectiveness, weight reduction, and ... -
ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. In surface mount technology (SMT), the precision of micro-scale passive components (MSPC) placement on printed circuit boards (PCBs) is critical, influenced by the self-alignment behavior after the soldering ... -
Thermo-Mechanical Simulation Framework for Assessing Process-Induced Delamination Risks in Large-Area Fan-Out Panel-Level Packaging
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. This study develops a finite element modeling (FEM) framework for predicting interfacial fracture behavior during the debonding stage of fan-out panel-level packaging (FOPLP). Although FOPLP offers advantages ... -
Uncertainty Quantification for Compressible Micro-Interconnects in Replaceable Integrated Chiplet Assembly Under Hypergravity
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The compressible micro-interconnects (CMIs) in replaceable integrated chiplet (PINCH) assemblies enable reusable integration in high-performance electronic devices. However, CMIs are sensitive to gravitational ... -
Reliability Analysis of a Microinverter Prototype: A Case Study on Sn-Ag-Cu Solder Under Thermal Fatigue for Encapsulated GaN Packages
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. A single-stage dual-active-bridge direct current-alternating current (DC-AC) micro-inverter prototype with Gallium Nitride (GaN) primary switching devices was assembled and subjected to environmental reliability ... -
Thermal Management of Three-Dimensional Chips and Monolithic Integrated Circuits Using Phase Change Materials–Si/Cu Composites
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. The increasing demand for high-performance computing has accelerated the development of three-dimensional integrated circuits (3DICs), which offer enhanced performance but pose significant thermal challenges due ... -
Improved Productivity With High-Speed Imaging for Printed Circuit Board Applications in Electronics Assembly
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Machine vision inspections need to go through complex surface textures, part deviations/curvatures, nonuniform lighting, highly reflective surfaces, and unpredictable defects, which introduce image quality issues ... -
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. This paper presents a novel insulated-gate bipolar transistor (IGBT) power module design that integrates phase change material (PCM) above the chips, coupled with an optimized metal frame, to enhance overcurrent ...