Journal of Electronic Packaging: Recent submissions
Now showing items 21-40 of 2123
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Impact of Thermal Cycling on Phase Change Material Based Thermal Management Systems
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Degradation of phase change materials (PCMs) is critical in the design of thermal management systems (TMSs). Although some previous studies have explored the long-term stability of PCMs, most have performed thermal ... -
Epoxy Molding Compound for Electronic Packaging: Impact of Inorganic Filler Type and Geometry
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Rapid technological advancements have increased the performance demands on electronic packaging materials, making epoxy molding compounds (EMCs) increasingly critical for electronic equipment. EMCs play a key ... -
Influence of Boundary Conditions and Component Placement on Lifetime of Printed Circuit Board Assemblies Under Vibration Loading: XGBoost and Stochastic Gradient Boosting Analysis With SHAP Interpretation
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Ensuring the vibration reliability of electronic packages is crucial for their long-term operation, especially in high-reliability environments. The research investigates the effects of boundary conditions, ... -
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Fans used in convective cooling applications generate undesirable broadband and tonal noise at the blade pass frequency (BPF) and its harmonics. Using separate noise-reducing devices such as mufflers and acoustic ... -
Thermomechanical Finite Element Analysis of Cu–SiCN Hybrid Bonding With Protruding and Recessed Cu Pad in Three-Dimensional Integrated Circuits
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Hybrid bonding is recognized as one of the most promising technologies to meet the demand of miniaturization in future three-dimensional integrated circuits. However, the ever-shrinking of Cu pad size poses new ... -
Propensity for Pad Cratering Evaluation in Board Resin and Board-Resin/Glass Interface Under Assembly and Rework
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Pad cratering is a major concern in high I/O ball grid array packaging architectures. Assessment of propensity for pad cratering is presently beyond the state of art. Failure in pad cratering is manifested through ... -
Feasibility Study of Implementing a Hybrid Single- and Two-Phase Cooler for High Power Density Power Electronics
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Thermal management is crucial in power module design nowadays, significantly influencing the cost, performance, and reliability of the traction inverters. As we strive for greater power density and smaller form ... -
Experimental Characterization of Geysering Instabilities in a Small-Scale Closed Loop Thermosyphon
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Closed loop thermosyphons (CLTs) are passive heat transfer devices, that when operating in a buoyancy-driven two-phase regime, can transfer heat nearly isothermally and thereby achieve excellent thermal performance. ... -
Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Two-phase jet impingement cooling is a promising solution for high-heat-flux semiconductor thermal management, as it combines strong convective heat transfer with boiling to remove large heat loads at relatively ... -
Thermal Design and Performance Modeling of a High Compute Density Liquid Cooled Chiller Less Modular Edge Data Center
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Holistic design of a modular energy-efficient edge datacenter with a compute density of 20 kW/m3 is presented. The datacenter uses a single chiller-less liquid loop to extract heat from server components and ... -
Impact of Dielectrophoretic Vapor Extraction Force on Electronics Performance
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Modern electronic systems are advancing rapidly, driving devices to operate at higher power levels within increasingly compact and challenging environments. This trend elevates the need for more capable thermal ... -
Two-Phase Jet Impingement Cooling With Copper Inverse Opal Coated Microfins Using Novec 649
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Two-phase jet impingement cooling is a promising technique for heat dissipation of high-power electronics, offering high heat transfer coefficients by directly targeting coolant onto hot surfaces. In this study, ... -
Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. In-plane thermal crosstalk is a crucial thermal management challenge, especially in silicon-based 2.5D heterogeneous integration systems, where the relatively high thermal conductivity of silicon interposers ... -
Inhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. This paper presents a method to enhance the reliability of Cu/Sn interfaces in semiconductor devices by inhibiting the formation of intermetallic compounds (IMCs). We explored the electrochemical deposition of ... -
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Thermal interface materials (TIMs) play a crucial role in thermal management in modern electronics, where minimizing overall thermal resistance is critical for reliable and efficient operation. Among various ... -
Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Applying cold plates to primary heat sources of high-performance compute (HPC) servers and pumping refrigerant through them is known as pumped two-phase (P2P) liquid cooling. Refrigerant to air (RA) and refrigerant ... -
Effect of Bismuth Addition to SAC305 on the Microstructure and Mechanical Properties of Solder Joints
(The American Society of Mechanical Engineers (ASME), 2026)Abstract. Two types of solder alloys—96.5Sn-3.0Ag-0.5Cu (SAC305) and SAC305 with the addition of 3.3% bismuth (Cyclomax)—are thermally aged, and their comparison is carried out in terms of solder joint microstructure and ... -
Optimization of the Reliability of Ball Grid Array Solder Joints Under Random Vibration Conditions Using an Improved Back Propagation Neural Network-Based Particle Swarm Algorithm
(The American Society of Mechanical Engineers (ASME), 2025) -
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection
(The American Society of Mechanical Engineers (ASME), 2025)The microstructure transformation, mechanical properties, and fracture behavior of boron (B) decorated tin (Sn)-1.5%Ag-0.7%copper (Cu) (SAC157) solder joints with Cu pillars were analyzed. Three concentrations of B (0.015%, ... -
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
(The American Society of Mechanical Engineers (ASME), 2025)Loop thermosiphons (LTSs) are highly effective two-phase heat spreaders, enabling significant heat transport through passive liquid–vapor phase-change, particularly beneficial in electronics cooling. However, prior studies ...