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    Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components

    Source: Journal of Electronic Packaging:;2026:;volume( 148 ):;issue:001::page 956
    Author:
    Kocak, Eyup
    ,
    Turkoglu, Hasmet
    DOI: 10.1115/1.4069986
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. In this study, heat transfer and temperature distribution characteristics of an electronic component covered with a porous medium were investigated both experimentally and numerically. An experimental setup was designed and constructed to conduct the experiments. For the numerical analysis, a computational fluid dynamics (cfd) software was developed on the openfoam platform. The experimental results were used to validate the mathematical model and the computer program developed. The validated computer program was used to investigate the effects of Reynolds number, porosity, Darcy number, porous layer sizes, and the channel height on the heat transfer rate from the heat dissipating elements (electronic component) to the flow in wider ranges of the parameters. Using the Nusselt number values obtained both experimentally and numerically, a correlation equation was developed, and an artificial neural network architecture was trained for the Nusselt number. Results show that the Nusselt number increases with increasing Reynolds number, porosity, and the ratio of the height of the porous layer to the channel height. It was observed that the width of the porous medium has no noticeable effect on the Nusselt number. The correlation equation developed with four independent parameters predicts the Nusselt number with an average error of 7.59%. The artificial neural network architecture developed prevails as a more accurate tool, with a maximum error of 1%, for the prediction of the Nusselt number in the range of the parameters considered.
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      Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components

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    contributor authorKocak, Eyup
    contributor authorTurkoglu, Hasmet
    date accessioned2026-08-23T08:24:08Z
    date available2026-08-23T08:24:08Z
    date copyright2026/03/01
    date issued2026
    identifier issn1043-7398
    identifier otherep-25-1019.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316495
    description abstractAbstract. In this study, heat transfer and temperature distribution characteristics of an electronic component covered with a porous medium were investigated both experimentally and numerically. An experimental setup was designed and constructed to conduct the experiments. For the numerical analysis, a computational fluid dynamics (cfd) software was developed on the openfoam platform. The experimental results were used to validate the mathematical model and the computer program developed. The validated computer program was used to investigate the effects of Reynolds number, porosity, Darcy number, porous layer sizes, and the channel height on the heat transfer rate from the heat dissipating elements (electronic component) to the flow in wider ranges of the parameters. Using the Nusselt number values obtained both experimentally and numerically, a correlation equation was developed, and an artificial neural network architecture was trained for the Nusselt number. Results show that the Nusselt number increases with increasing Reynolds number, porosity, and the ratio of the height of the porous layer to the channel height. It was observed that the width of the porous medium has no noticeable effect on the Nusselt number. The correlation equation developed with four independent parameters predicts the Nusselt number with an average error of 7.59%. The artificial neural network architecture developed prevails as a more accurate tool, with a maximum error of 1%, for the prediction of the Nusselt number in the range of the parameters considered.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleNumerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components
    typeJournal Paper
    journal volume148
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4069986
    journal fristpage956
    journal lastpage965
    page10
    treeJournal of Electronic Packaging:;2026:;volume( 148 ):;issue:001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian