YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni

    Source: Journal of Electronic Packaging:;2026:;volume( 148 ):;issue:003::page 237
    Author:
    Zhang, Ying
    ,
    Wang, Jingqin
    DOI: 10.1115/1.4070887
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Abstract. Conventional approaches to enhance Ag/Ni contact material performance have involved experimental trial-and-error processes. The research employs computational modeling and experimental verification to investigate how doping enhances the performance of Ag/Ni materials. The Cu, C-doped Ag/Ni(17) interface model was constructed and optimized through first-principles density functional theory calculations. The regulation mechanism of doped elements at the interface is explained based on energy parameter calculations and electronic structure analysis. According to simulations, it is anticipated that C-doped Ag/Ni(17) exhibits the best interfacial bonding strength and the greatest stability, which dovetails with superior wettability and electrical contact capabilities. Subsequently, Cu, C-doped Ag/Ni(17) were prepared using a combination of mechanical alloying process powder mixing and powder metallurgy. The consistency of the interface model with the experimentally prepared contact materials was verified by qualitative analysis of the physical phase structure from X-ray diffraction experiments. The wettability experiments yielded outcomes that align closely with the forecasts of the simulations. The welding force and arc energy experiments demonstrate that the C-doped Ag/Ni(17) exhibits superior welding resistance. The achievement lays a solid theoretical groundwork for the screening of dopant elements, with the ultimate goal of boosting the performance of Ag/Ni materials.
    • Download: (1.468Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Statistics

      First-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni

    URI
    https://yetl.yabesh.ir/yetl1/handle/yetl/4316388
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorZhang, Ying
    contributor authorWang, Jingqin
    date accessioned2026-08-23T08:19:26Z
    date available2026-08-23T08:19:26Z
    date copyright2026/09/01
    date issued2026
    identifier issn1043-7398
    identifier otherep-25-1094.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4316388
    description abstractAbstract. Conventional approaches to enhance Ag/Ni contact material performance have involved experimental trial-and-error processes. The research employs computational modeling and experimental verification to investigate how doping enhances the performance of Ag/Ni materials. The Cu, C-doped Ag/Ni(17) interface model was constructed and optimized through first-principles density functional theory calculations. The regulation mechanism of doped elements at the interface is explained based on energy parameter calculations and electronic structure analysis. According to simulations, it is anticipated that C-doped Ag/Ni(17) exhibits the best interfacial bonding strength and the greatest stability, which dovetails with superior wettability and electrical contact capabilities. Subsequently, Cu, C-doped Ag/Ni(17) were prepared using a combination of mechanical alloying process powder mixing and powder metallurgy. The consistency of the interface model with the experimentally prepared contact materials was verified by qualitative analysis of the physical phase structure from X-ray diffraction experiments. The wettability experiments yielded outcomes that align closely with the forecasts of the simulations. The welding force and arc energy experiments demonstrate that the C-doped Ag/Ni(17) exhibits superior welding resistance. The achievement lays a solid theoretical groundwork for the screening of dopant elements, with the ultimate goal of boosting the performance of Ag/Ni materials.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleFirst-Principles Computational Prediction of Doping to Improve the Properties of Ag/Ni
    typeJournal Paper
    journal volume148
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.4070887
    journal fristpage237
    journal lastpage245
    page9
    treeJournal of Electronic Packaging:;2026:;volume( 148 ):;issue:003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian