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    Effects of Fluctuating Moisture and Temperature on the Mechanical Response of Resin-Plates

    Source: Journal of Applied Mechanics:;1977:;volume( 044 ):;issue: 004::page 571
    Author:
    Y. Weitsman
    DOI: 10.1115/1.3424137
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper concerns the stress-response of a geometrically constrained resin-slab under externally fluctuating moisture and temperature conditions. The response of the resin is described by a rheologically complex viscoelastic behavior and is analyzed on the basis of the best data that is available at present. The results indicate that the stresses can undergo a change in sign when a test coupon is subjected to a “thermal spike”. This observation may explain the fracture and cracking that has been detected experimentally. In addition, sample results are provided for the residual stresses that develop upon cool-down. It is shown that in this case a subsequent exposure to moisture may contribute to the reduction of such stresses. A brief discussion is provided concerning the diffusion of moisture under fluctuating temperatures.
    keyword(s): Temperature , Plates (structures) , Resins , Stress , Fracture (Process) , Viscoelasticity , Diffusion (Physics) , Residual stresses AND Slabs ,
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      Effects of Fluctuating Moisture and Temperature on the Mechanical Response of Resin-Plates

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    http://yetl.yabesh.ir/yetl1/handle/yetl/89417
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    contributor authorY. Weitsman
    date accessioned2017-05-08T23:02:05Z
    date available2017-05-08T23:02:05Z
    date copyrightDecember, 1977
    date issued1977
    identifier issn0021-8936
    identifier otherJAMCAV-26081#571_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/89417
    description abstractThis paper concerns the stress-response of a geometrically constrained resin-slab under externally fluctuating moisture and temperature conditions. The response of the resin is described by a rheologically complex viscoelastic behavior and is analyzed on the basis of the best data that is available at present. The results indicate that the stresses can undergo a change in sign when a test coupon is subjected to a “thermal spike”. This observation may explain the fracture and cracking that has been detected experimentally. In addition, sample results are provided for the residual stresses that develop upon cool-down. It is shown that in this case a subsequent exposure to moisture may contribute to the reduction of such stresses. A brief discussion is provided concerning the diffusion of moisture under fluctuating temperatures.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleEffects of Fluctuating Moisture and Temperature on the Mechanical Response of Resin-Plates
    typeJournal Paper
    journal volume44
    journal issue4
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.3424137
    journal fristpage571
    journal lastpage576
    identifier eissn1528-9036
    keywordsTemperature
    keywordsPlates (structures)
    keywordsResins
    keywordsStress
    keywordsFracture (Process)
    keywordsViscoelasticity
    keywordsDiffusion (Physics)
    keywordsResidual stresses AND Slabs
    treeJournal of Applied Mechanics:;1977:;volume( 044 ):;issue: 004
    contenttypeFulltext
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