Effects of Fluctuating Moisture and Temperature on the Mechanical Response of Resin-PlatesSource: Journal of Applied Mechanics:;1977:;volume( 044 ):;issue: 004::page 571Author:Y. Weitsman
DOI: 10.1115/1.3424137Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper concerns the stress-response of a geometrically constrained resin-slab under externally fluctuating moisture and temperature conditions. The response of the resin is described by a rheologically complex viscoelastic behavior and is analyzed on the basis of the best data that is available at present. The results indicate that the stresses can undergo a change in sign when a test coupon is subjected to a “thermal spike”. This observation may explain the fracture and cracking that has been detected experimentally. In addition, sample results are provided for the residual stresses that develop upon cool-down. It is shown that in this case a subsequent exposure to moisture may contribute to the reduction of such stresses. A brief discussion is provided concerning the diffusion of moisture under fluctuating temperatures.
keyword(s): Temperature , Plates (structures) , Resins , Stress , Fracture (Process) , Viscoelasticity , Diffusion (Physics) , Residual stresses AND Slabs ,
|
Collections
Show full item record
contributor author | Y. Weitsman | |
date accessioned | 2017-05-08T23:02:05Z | |
date available | 2017-05-08T23:02:05Z | |
date copyright | December, 1977 | |
date issued | 1977 | |
identifier issn | 0021-8936 | |
identifier other | JAMCAV-26081#571_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/89417 | |
description abstract | This paper concerns the stress-response of a geometrically constrained resin-slab under externally fluctuating moisture and temperature conditions. The response of the resin is described by a rheologically complex viscoelastic behavior and is analyzed on the basis of the best data that is available at present. The results indicate that the stresses can undergo a change in sign when a test coupon is subjected to a “thermal spike”. This observation may explain the fracture and cracking that has been detected experimentally. In addition, sample results are provided for the residual stresses that develop upon cool-down. It is shown that in this case a subsequent exposure to moisture may contribute to the reduction of such stresses. A brief discussion is provided concerning the diffusion of moisture under fluctuating temperatures. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effects of Fluctuating Moisture and Temperature on the Mechanical Response of Resin-Plates | |
type | Journal Paper | |
journal volume | 44 | |
journal issue | 4 | |
journal title | Journal of Applied Mechanics | |
identifier doi | 10.1115/1.3424137 | |
journal fristpage | 571 | |
journal lastpage | 576 | |
identifier eissn | 1528-9036 | |
keywords | Temperature | |
keywords | Plates (structures) | |
keywords | Resins | |
keywords | Stress | |
keywords | Fracture (Process) | |
keywords | Viscoelasticity | |
keywords | Diffusion (Physics) | |
keywords | Residual stresses AND Slabs | |
tree | Journal of Applied Mechanics:;1977:;volume( 044 ):;issue: 004 | |
contenttype | Fulltext |