| contributor author | Lau, John H. | |
| date accessioned | 2025-04-21T10:35:45Z | |
| date available | 2025-04-21T10:35:45Z | |
| date copyright | 6/20/2024 12:00:00 AM | |
| date issued | 2024 | |
| identifier issn | 1043-7398 | |
| identifier other | ep_147_01_011004.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4306516 | |
| description abstract | The trends in co-packaged optics (CPO) will be investigated in this study. Emphasis is placed on the heterogeneous integration of photonic integrated circuit (PIC) and electronic IC (EIC). In particular, two-dimensional (2D) and three-dimensional (3D) heterogeneous integration of application specific IC (ASIC) switch, PIC, and EIC w/o bridges, and heterogeneous integration of ASIC switch, PIC, and EIC on glass substrate will be discussed. Some recommendations will be provided. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits | |
| type | Journal Paper | |
| journal volume | 147 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4065667 | |
| journal fristpage | 11004-1 | |
| journal lastpage | 11004-12 | |
| page | 12 | |
| tree | Journal of Electronic Packaging:;2024:;volume( 147 ):;issue: 001 | |
| contenttype | Fulltext | |
