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    Numerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process

    Source: Journal of Micro and Nano-Manufacturing:;2024:;volume( 011 ):;issue: 003::page 31001-1
    Author:
    Mondal, Partha Protim
    ,
    Ferreira, Placid Matthew
    ,
    Kapoor, Shiv Gopal
    ,
    Bless, Patrick
    DOI: 10.1115/1.4065327
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes the development of a finite element simulation model and a self-made low-cost experimental setup for the micro hot embossing process. The simulation model incorporates stress relaxation behavior through the utilization of the generalized Maxwell model. It also considers thermal expansion and contact friction effects, enabling accurate prediction of the deformed pattern of polymethyl methacrylate (PMMA). Simulations and experiments were performed for various pressure and temperature combinations, and the resulting pattern profile depths were found to be in good agreement, between the simulation and experimental results. In addition, the simulation model was used to generate response surfaces through face-centered central composite design (CCD) to identify the ideal combination of process parameters of the micro hot embossing process for creating a patterned SMD (surface mount device) LED chip panel.
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      Numerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process

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    contributor authorMondal, Partha Protim
    contributor authorFerreira, Placid Matthew
    contributor authorKapoor, Shiv Gopal
    contributor authorBless, Patrick
    date accessioned2024-12-24T19:08:17Z
    date available2024-12-24T19:08:17Z
    date copyright5/8/2024 12:00:00 AM
    date issued2024
    identifier issn2166-0468
    identifier otherjmnm_011_03_031001.pdf
    identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4303355
    description abstractThis paper describes the development of a finite element simulation model and a self-made low-cost experimental setup for the micro hot embossing process. The simulation model incorporates stress relaxation behavior through the utilization of the generalized Maxwell model. It also considers thermal expansion and contact friction effects, enabling accurate prediction of the deformed pattern of polymethyl methacrylate (PMMA). Simulations and experiments were performed for various pressure and temperature combinations, and the resulting pattern profile depths were found to be in good agreement, between the simulation and experimental results. In addition, the simulation model was used to generate response surfaces through face-centered central composite design (CCD) to identify the ideal combination of process parameters of the micro hot embossing process for creating a patterned SMD (surface mount device) LED chip panel.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleNumerical Modeling, Experimental Investigation, and Optimization of a Micro Hot Embossing Process
    typeJournal Paper
    journal volume11
    journal issue3
    journal titleJournal of Micro and Nano-Manufacturing
    identifier doi10.1115/1.4065327
    journal fristpage31001-1
    journal lastpage31001-5
    page5
    treeJournal of Micro and Nano-Manufacturing:;2024:;volume( 011 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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