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contributor authorShahi, Pardeep
contributor authorHeydari, Ali
contributor authorEslami, Bahareh
contributor authorRadmard, Vahideh
contributor authorHinge, Chandraprakash
contributor authorModi, Himanshu
contributor authorChinthaparthy, Lochan Sai Reddy
contributor authorTradat, Mohammad
contributor authorAgonafer, Dereje
contributor authorRodriguez, Jeremy
date accessioned2024-12-24T18:50:38Z
date available2024-12-24T18:50:38Z
date copyright8/17/2024 12:00:00 AM
date issued2024
identifier issn1043-7398
identifier otherep_146_04_041117.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302853
description abstractDemand is growing for the dense and high-performing IT computing capacity to support artificial intelligence, deep learning, machine learning, autonomous cars, the Internet of Things, etc. This led to an unprecedented growth in transistor density for high-end CPUs and GPUs, creating thermal design power (TDP) of even more than 700 watts for some of the NVIDIA existing GPUs. Cooling these high TDP chips with air cooling comes with a cost of the higher form factor of servers and noise produced by server fans close to the permissible limit. Direct-to-chip cold plate-based liquid cooling is highly efficient and becoming more reliable as the advancement in technology is taking place. Several components are used in the liquid-cooled data centers for the deployment of cold plate-based direct-to-chip liquid cooling like cooling loops, rack manifolds, CDUs, row manifolds, quick disconnects, flow control valves, etc. Row manifolds used in liquid cooling are used to distribute secondary coolant to the rack manifolds. Characterizing these row manifolds to understand the pressure drops and flow distribution for better data center design and energy efficiency is important. In this paper, the methodology is developed to characterize the row manifolds. Water-based coolant Propylene glycol 25% was used as the coolant for the experiments and experiments were conducted at 21 °C coolant supply temperature. Two, six-port row manifolds' P-Q curves were generated, and the value of supply pressure and the flowrate were measured at each port. The results obtained from the experiments were validated by a technique called flow network modeling (FNM). FNM technique uses the overall flow and thermal characteristics to represent the behavior of individual components.
publisherThe American Society of Mechanical Engineers (ASME)
titleMethodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
typeJournal Paper
journal volume146
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4065948
journal fristpage41117-1
journal lastpage41117-6
page6
treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004
contenttypeFulltext


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