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contributor authorHarsono, Jessica
contributor authorKozak, Joseph P.
contributor authorTomey, Hala
contributor authorYerkes, William
contributor authorNeville, Jonathan
date accessioned2024-12-24T18:50:27Z
date available2024-12-24T18:50:27Z
date copyright8/9/2024 12:00:00 AM
date issued2024
identifier issn1043-7398
identifier otherep_146_04_041111.pdf
identifier urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4302846
description abstractSince most traditional spacecrafts are designed to operate in a vacuum environment, forced convection cooling has seen limited use in space-applications. This paper considers an ideal candidate—the Dragonfly Lander, a rotorcraft being sent into deep-space to conduct experiments on Saturn's largest moon, Titan. A forced convection based thermal management solution is presented for the rotor drive electronics (RDE) unit, a high-power electronics box responsible for controlling the rotors that allow the Lander to fly on Titan. A thermal flow model was built in Solidworks Flow Simulation to evaluate the effectiveness of a fan system integrated into the packaging design and used as the primary method for cooling the RDE. The model was validated with temperature data collected from custom designed ground support equipment. It was found that utilizing forced convection allows temperatures of the electronics within the tightly packaged RDE to remain within operational limits when conductive and radiative heat transfer alone are insufficient. Titan's dense atmosphere results in greater mass flow rates through fans compared to on Earth, making forced convection a particularly efficient method of heat transfer. This research may guide the use of forced convection in future space missions, or nontraditional environments.
publisherThe American Society of Mechanical Engineers (ASME)
titleConvection Cooling of Power Electronics Operating in Deep-Space
typeJournal Paper
journal volume146
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4065947
journal fristpage41111-1
journal lastpage41111-7
page7
treeJournal of Electronic Packaging:;2024:;volume( 146 ):;issue: 004
contenttypeFulltext


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