An Experimental Investigation of Sintered Particle Effect on Heat Transfer Performance in an “Annular Flow” Evaporation TubeSource: Journal of Thermal Science and Engineering Applications:;2024:;volume( 016 ):;issue: 007::page 71001-1Author:Spitzenberger, Jeremy
,
Hoelle, James
,
Abdulheiba, Ahmed
,
Mohammed, Ramy H.
,
Ismael, Laith
,
Agonafer, Damena
,
Wang, Pengtao
,
Kowalski, Stephen
,
Nawaz, Kashif
,
Ma, Hongbin
DOI: 10.1115/1.4065259Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working fluid and thin film evaporation, they can result in capillary evaporation and further enhance the evaporation heat transfer. In this study, a 0.5 mm thick layer of 105 µm sintered copper particles was added to the inner wall of a copper tube, aiming to form an “annular flow” and enhance the heat transfer characteristics by taking advantage of thin film and capillary evaporation. Acetone was chosen as the working fluid, and the performance of an evaporation tube was tested for power inputs of 10, 30, 50, and 70 W. For each power input, trials were run at inclination angles varying from −90 deg to 90 deg to investigate the capillary effects. The temperature measurements showed that the temperature distribution along the evaporation tube is always downward sloping, meaning the temperature at the fluid inlet is larger than the outlet. Results show that an “annular flow” formed by a thin layer of sintered particles can promote thin film and capillary evaporation and, therefore, boost the evaporation heat transfer coefficient.
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contributor author | Spitzenberger, Jeremy | |
contributor author | Hoelle, James | |
contributor author | Abdulheiba, Ahmed | |
contributor author | Mohammed, Ramy H. | |
contributor author | Ismael, Laith | |
contributor author | Agonafer, Damena | |
contributor author | Wang, Pengtao | |
contributor author | Kowalski, Stephen | |
contributor author | Nawaz, Kashif | |
contributor author | Ma, Hongbin | |
date accessioned | 2024-12-24T18:42:12Z | |
date available | 2024-12-24T18:42:12Z | |
date copyright | 4/23/2024 12:00:00 AM | |
date issued | 2024 | |
identifier issn | 1948-5085 | |
identifier other | tsea_16_7_071001.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4302591 | |
description abstract | Wicking structures have been widely used within passive heat transfer devices with high heat fluxes, such as heat pipes, to enhance their thermal performance. While wicking structures promote capillary pumping of the working fluid and thin film evaporation, they can result in capillary evaporation and further enhance the evaporation heat transfer. In this study, a 0.5 mm thick layer of 105 µm sintered copper particles was added to the inner wall of a copper tube, aiming to form an “annular flow” and enhance the heat transfer characteristics by taking advantage of thin film and capillary evaporation. Acetone was chosen as the working fluid, and the performance of an evaporation tube was tested for power inputs of 10, 30, 50, and 70 W. For each power input, trials were run at inclination angles varying from −90 deg to 90 deg to investigate the capillary effects. The temperature measurements showed that the temperature distribution along the evaporation tube is always downward sloping, meaning the temperature at the fluid inlet is larger than the outlet. Results show that an “annular flow” formed by a thin layer of sintered particles can promote thin film and capillary evaporation and, therefore, boost the evaporation heat transfer coefficient. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Experimental Investigation of Sintered Particle Effect on Heat Transfer Performance in an “Annular Flow” Evaporation Tube | |
type | Journal Paper | |
journal volume | 16 | |
journal issue | 7 | |
journal title | Journal of Thermal Science and Engineering Applications | |
identifier doi | 10.1115/1.4065259 | |
journal fristpage | 71001-1 | |
journal lastpage | 71001-9 | |
page | 9 | |
tree | Journal of Thermal Science and Engineering Applications:;2024:;volume( 016 ):;issue: 007 | |
contenttype | Fulltext |